The Materials Center Leoben Forschung GmbH (MCL) is the leading Austrian institution in the field of applied Materials Science with around 150 employees. In particular, it is the carrier of the Comet K2 Center Material-Processes and Product Engineering (MPPE) which is the largest competence center in the field of research on application of materials in Austria. This center allows MCL to be a key member in a network of innovative scientific and industrial partners with expertise along the entire supply chain. About 30 scientific institutions and about 70 companies are working together in this network on material based innovations in the fields of reliability of products and processes and novel materials solution for the application of the next decades.
The MCL research program focuses on the integrated simulation of materials and components across the entire supply chain and on all length scales. This means modeling the entire process chain from the raw material via forming processes to component manufacture and further on till deployment and analyzing the materials and their properties from the atomic via the microscopic to the macroscopic level. The main material classes tangled are metals and ceramics, combinations of material classes in all possible ways and habits from bulk over layered to thin film.
MCL research is therefore based on two pillars:
- Analytical laboratories: The analytical laboratories at MCL are organized as common and open platform for all research activities. The labs (Metallographic Laboratory, Electron Microscopy, Structure Thermal and Chemical Properties, Temperature Treatment, Mechanical Testing and Microelectronics) deliver high precision analytical data along (nearly) all length scales and many application related properties like local crack growth and time to failure under various loading conditions.
- Simulation Groups: The simulation activities at MCL focus on (a) Finite Element Simulation for the study of stress development, crack growth and design improvement (b) Atomistic modeling for the determination of chemical composition, physical constants and diffusion pathways and (c) on the combination of different types of simulation techniques (e.g. fluid dynamics with mechanics) to solve issues in processes and application.
- Steel Technology tangles novel solution in the application, temperature treatment and the composition of steel materials.
- Tooling is focusing on hard metals, coatings and processes for the fabrication of those and also includes tool reliability and design.
- Materials for Micro- and Nanoelectronics, is focused on 3D Integration, Packaging and integration of Sensors.
In the context of thematic research areas MCL focuses on Steel technology, Tooling and since March 2012, on Materials for Micro- and Nanoelectronics.
MCL contribution to POLIS:
The influence of wafer bonding parameters like temperature, pressure, time and surface roughness by further developing a true contact area model will be clarified. Introduction of Cu-texture-influences and different creep-approaches will leverage the true contact area model to more realistic description of real devices.
The work will be continued with the development of a semi-empiric physical model to describe grain growth dynamics during the wafer bonding process. Purpose of this is to study physical processes focusing on the dynamics of Cu-recristallisation at the bonding interface to enable direct insight into the mechanics of bonding strength. The resulting empirical model will describe the wafer bonding strength as a function of grain growth development as conditioned by the Cu-deposition process, the bonding process and the post bond treatment process.
Finally micromechanical investigations will be used to describe the development of failure modes under the influence of thermo mechanical load. Corresponding simulation models will provide predictability of damage evolution in low cyclic fatigue regimes and/or temperature treatments.