EV GROUP E. THALLNER GMBH

Logo EVG

Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL).

The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; Seoul, South Korea; Chung-Li, Taiwan and Shanghai, China. EVG is also active in numerous collaborative research projects worldwide. In the area of 3D IC research programs, EVG is involved in projects such as 3DICE (EURIPIDES), ESiP (ENIAC) and COCOA (Catrene).